Description:
Conventional flat-plate heating elements consist of a resistive element that
is encapsulated in electrical insulation. With application of electrical power,
current flows in the resistive element, generating heat. The resistive element
temperature rises and heat is conducted across the insulation. At high
power-density, the low thermal conductance of the insulation causes the
resistive element to reach unacceptably high temperatures, and this limits
performance. Consequently, power densities are generally limited to less than
50W/cm2 surface area.
The High Power-Density Plane-Surface Heating Element is a compact, flat
device that circumvents the issue of conduction across low thermal conductivity
electrical insulation such that there is only a relatively small temperature
rise of device components. It allows for at least an order of magnitude increase
in power density (>500W/cm2). The device is fabricated from readily available
materials using established processes. The plan-area size and shape can range
from mm-scale to ˜100cm2.
Features
Order of Magnitude (10X) increase in performance over existing technology
Simple, robust architecture
- Heating System = heating element + power supply + power controller
- Variable size and plan form shape, up to ˜100cm2
- Tunable voltage/current ratio (DC or AC)
- Bondable external surface (adhesive or braze)
- Tolerant to harsh environments
- No hazardous materials or pollutants
- Receptive to guard heater architecture (unidirectional heat flow)
Straightforward fabrication
Applications
Economical and environmentally friendly alternative to:
- Complex burner gas (flame heating) systems
- High-temperature radiant systems
- Laser irradiation systems
Opportunity
Available for non-exclusive or exclusive licensing. UNR is seeking
expressions of interest from parties interested in collaborative research to
further develop, evaluate, or commercialize this technology.
IP Status
UNR ID#: UNR11-004
High Power-Density Plane-Surface Heating Element
US
Patent Appl#: 13/457,282